Data Center--MIJOINT

Solution Overview

Overview

Data center infrastructure continues to upgrade, placing higher demands on high-speed backplanes, near-ASIC cabling, external high-speed cables, and high-density connectors. Products need to take into account high-speed signal integrity, compact space layout, stable connection reliability, and large-scale deployment efficiency.

Serving leading customers such as Cisco and Alibaba, covering high-speed backplane automation lines such as NearStack and Impel Gen6.

Needs & Solution

Needs and plans

Industry needs and pain points

MIJOINT Solution

MIJOINT provides full line automation solutions for high-speed backplane connectors, high-speed wire harnesses and near-chip interconnect components for data center scenarios. The solution is centered on high-precision carriers, visual guidance, automatic pin insertion, welding process control, AOI/3D inspection and MES data traceability, covering the complete process from key parts assembly to finished product inspection and packaging.

In the NearStack scenario, the solution covers terminal assembly, welding, CAN assembly and AOI inspection; in the Impel Gen6 scenario, the solution covers terminal assembly welding, wiring, wire processing, resistance welding, injection molding, shield assembly welding and AOI inspection; in the ExaMAX2 scenario, the solution covers Housing, T-TOP, Tail Organizer assembly, AOI/3D size inspection and packaging.

Process & Capability

Craftsmanship and capabilities

Customer Verification

Customer verification

MIJOINT provides full line automation solutions for high-speed backplane connectors, high-speed wire harnesses and near-chip interconnect components for data center scenarios. The solution is centered on high-precision carriers, visual guidance, automatic pin insertion, welding process control, AOI/3D inspection and MES data traceability, covering the complete process from key parts assembly to finished product inspection and packaging.

In the NearStack scenario, the solution covers terminal assembly, welding, CAN assembly and AOI inspection; in the Impel Gen6 scenario, the solution covers terminal assembly welding, wiring, wire processing, resistance welding, injection molding, shield assembly welding and AOI inspection; in the ExaMAX2 scenario, the solution covers Housing, T-TOP, Tail Organizer assembly, AOI/3D size inspection and packaging.